Tag Archives: Labelexpo

Wide-web digital printing for flexible packaging takes another step ahead

Posted on June 26, 2013 by Mark Spaulding

In this my final installment on the HP Indigo Worldwide VIP event held last week in Israel, here’s an update primarily on developments in wide-web digital printing for flexible packaging. Transforming the packaged-goods industry today are three major trends – … Continue reading →

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Labelexpo Americas 2012: It was “A Materials World”

Posted on September 27, 2012 by Mark Spaulding

Now that the dust has settled on another Labelexpo Americas, the following provides a glimpse at just a few of the many new coated and laminated materials that debuted at the biennial tradeshow and conference. For the show itself, a … Continue reading →

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It’s like that “Where’s Waldo?” game

Posted on September 9, 2012 by Mark Spaulding

Remember that “Where’s Waldo?” game from years back where you had to look through seriously complicated drawings of huge crowds of people to find the Waldo character? Well, that’s kinda like how it’ll be finding me in the coming months … Continue reading →

Posted in coating/laminating, flexible packaging, labels, paper/paperboard/cartons, printed electronics, slitting/rewinding | Tagged , , , , , , , , , , , , , , | Leave a comment