Category Archives: printed electronics

drupa 2012 Report: From nanography to adhesive lamination

Posted on May 6, 2012 by

You’ve got only 10 days to get yourself over to Düsseldorf, Germany, for what’s left of drupa 2012. Yes, in one sense, that’s saying quite a lot because any other trade show that started on May 3 would have long … Continue reading →

Posted in coating/laminating, digital printing, flexible packaging, labels, package printing, paper/paperboard/cartons, printed electronics, slitting/rewinding, sustainability | Tagged , , , , , , , , , , , , , , , , | 1 Comment

Next CI meeting: From soup to nuts

Posted on April 16, 2012 by

With featured speakers on film technology, sustainability, packaging and nonwovens, the next meeting of Converting Influence will offer something for everyone. The spring program, set for May 17 at the Bordini Center of Fox Valley Technical College in Appleton, WI, … Continue reading →

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Steering toward a bigger, better ICE USA 2013

Posted on April 5, 2012 by

Pretty much halfway between last year’s successful premiere of ICE USA (Intl. Converting Exhibition) and the next edition, I took part in a Steering Committee meeting on Tuesday for the 2013 show, along with nine other industry-advisory members. (Check out … Continue reading →

Posted in coating/laminating, digital printing, flexible packaging, labels, package printing, paper/paperboard/cartons, printed electronics, slitting/rewinding | Tagged , , , , , , , , , , , , | Leave a comment